If you've no account register here first time
User Name :
User Email :
Password :

Login Now

IBM Says New Advance Makes Chips More Energy-Efficient

I.B.M. has designed a new material that could increase the speed of semiconductors and reduce their energy consumption, The New York Times reports.

The advance involves a manufacturing process that uses heat to create trillions of atomic-scale holes in a thin layer of material deposited on top of the conducting wires at different stages of chip making.

I.B.M. says the insulation technique can increase chip speed as much as 35 percent with a 15 percent reduction in energy consumption.

I.B.M. plans to share the new technology approach with its manufacturing and technology partners.

Top 10 Steps for a Successful EMIS Project
Sponsored By: Sphera Solutions

  
Financing Environmental Resiliency and a Low-Carbon Future with Green Bonds
Sponsored By: NSF International

  
The EHS Guidebook: Selecting, Implementing, and Using EHS Software Solutions
Sponsored By: EtQ

  
Choosing the Correct Emission Control Technology
Sponsored By: Anguil Environmental Systems

  

Leave a Comment