Dow Electronic Materials will next week launch its more sustainable surface finishing solutions for the electronic and industrial finishing markets, which provide alternatives to the use of cyanide, nickel and lead as well as improvements in process efficiencies and waste reduction, the company says.
The company says its cyanide-free silver solutions provide robust performance in both decorative and functional applications. Silveron GT-101 Cyanide Free Silver and Silveron GT-820 Cyanide Free Silver Tin offer brightness, adhesion, contact resistance and solderability, and can be applied to both copper and nickel alloys.
Dow’s latest electrolytic tin products offer matte and bright tin solutions for electronic finishing applications. Solderon ST-300T Matte Tin (pictured) provides distribution over a wide current density range, and Solderon BHT-350 Bright Tin, a low carbon deposit, demonstrates high ductility from an electrolyte with high cathode efficiency across a wide operating window, the company says.
For applications demanding nickel-free finishes, in response to regulatory requirements, Dow’s cyanide-and-lead-free white bronze products replace the use of nickel for human and water contact applications. Ronalloy GT-250 White Bronze and Aqualloy GT-640 Cyanide Free White Bronze offer mirror-like, bright white and corrosion resistant bronze deposits.
To realize the needs for selective metallization or etching, Dow’s Lithojet 200 Series Ink for inkjet masking offers off contact, digital processing with rapid design change, prototyping, and mass production capability. Compared to conventional masking systems, it can provide higher yields and shorter processes with reduced consumables, wastewater and power, the company says.
Dow will launch the new products at the O&S International Trade Fair for Surface Treatments and Coatings, June 24-26.